MediaTek has recently unveiled the powerful Dimensity 7300 chip, equipped with AI capabilities and designed to support folding phones. The two latest chipsets, Dimensity 7300 and Dimensity 7300X have been officially introduced, targeting mid-range smartphones and folding phone segments. These chips are manufactured on a 4nm process, offering strong performance and impressive energy savings.
The standout feature of these chips is the significantly improved AI processing capabilities, thanks to the new APU 655 processor, which boasts double the performance of the previous generation. This enhancement allows smoother AI applications, delivering an enhanced user experience on mid-range devices.
Additionally, the Dimensity 7300 and 7300X feature a powerful 8-core CPU that consumes 25% less power and an Arm Mali-G615 GPU that provides 20% faster frame rates and 20% improved energy efficiency. The MediaTek Imagiq 950 technology supports cameras up to 200 MP, offering noise reduction, accurate facial recognition, and 4K HDR video recording with a 50% wider dynamic range, catering to users’ gaming, photography, and video recording needs.
Notably, the Dimensity 7300X is specifically designed for vertical folding phones, supporting dual screens and unlocking new creative potential for manufacturers.
While MediaTek has not announced specific devices that will utilize these chips, it is anticipated that they will soon be integrated into “affordable” smartphones and upcoming folding phones, bringing high-end experiences to users in the mid-range segment.
